Diagram comparing traditional data center interconnects with Co-Packaged Optics, showing the integration of optical engines directly onto the processor die for reduced distance and power.

Co-Packaged Optics: Powering the AI Data Center Revolution

The exponential growth of Artificial Intelligence (AI), Machine Learning (ML), and High-Performance Computing (HPC) has triggered an unprecedented demand for data throughput. Modern AI models, from large language models (LLMs) to complex genomic simulations, are ... Continue Reading →